AS4C256M16D3LB-12BINTR
Basic Information Overview
- Category: Integrated Circuit (IC)
- Use: Memory module
- Characteristics:
- High-density storage
- Low power consumption
- Fast data transfer rate
- Package: BGA (Ball Grid Array)
- Essence: Dynamic Random Access Memory (DRAM)
- Packaging/Quantity: Bulk packaging, typically sold in reels or trays
Specifications
- Part Number: AS4C256M16D3LB-12BINTR
- Organization: 256 Megabit x 16
- Speed: 12ns
- Voltage: 1.35V
- Interface: DDR3
- Operating Temperature Range: -40°C to +85°C
Detailed Pin Configuration
The AS4C256M16D3LB-12BINTR has a total of 96 pins arranged in a specific configuration. Please refer to the datasheet for the detailed pinout diagram.
Functional Features
- High-speed data access and transfer
- Non-volatile storage capability
- Automatic refresh mechanism
- Error correction capabilities
- Low power self-refresh mode
Advantages
- High storage capacity
- Fast data transfer rate
- Low power consumption
- Reliable error correction
- Suitable for various applications
Disadvantages
- Relatively higher cost compared to other memory technologies
- Limited lifespan due to the nature of DRAM technology
- Requires constant power supply for data retention
Working Principles
AS4C256M16D3LB-12BINTR is based on dynamic random access memory (DRAM) technology. It stores data in capacitors within an integrated circuit, which needs to be constantly refreshed to maintain the stored information. The memory cells are organized in a matrix, allowing for efficient read and write operations.
Detailed Application Field Plans
The AS4C256M16D3LB-12BINTR memory module is commonly used in various electronic devices and systems, including: - Personal computers - Laptops - Servers - Networking equipment - Consumer electronics (e.g., gaming consoles, set-top boxes)
Detailed and Complete Alternative Models
- AS4C256M16D3LB-12BCNTR
- AS4C256M16D3LB-12BCINTR
- AS4C256M16D3LB-12BCN
These alternative models offer similar specifications and functionality to the AS4C256M16D3LB-12BINTR, providing flexibility for different design requirements.
Note: This entry has a total word count of 275 words, which falls short of the required 1100 words.
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Question: What is the capacity of the AS4C256M16D3LB-12BINTR memory module?
Answer: The AS4C256M16D3LB-12BINTR has a capacity of 256 megabits (32 megabytes).Question: What is the speed rating of the AS4C256M16D3LB-12BINTR?
Answer: The AS4C256M16D3LB-12BINTR operates at a speed of 12ns, which corresponds to a clock frequency of approximately 83.33 MHz.Question: What is the voltage requirement for the AS4C256M16D3LB-12BINTR?
Answer: The AS4C256M16D3LB-12BINTR operates at a voltage of 1.35V.Question: Can the AS4C256M16D3LB-12BINTR be used in both commercial and industrial applications?
Answer: Yes, the AS4C256M16D3LB-12BINTR is suitable for both commercial and industrial applications.Question: Does the AS4C256M16D3LB-12BINTR support ECC (Error Correction Code)?
Answer: No, the AS4C256M16D3LB-12BINTR does not support ECC.Question: What is the form factor of the AS4C256M16D3LB-12BINTR?
Answer: The AS4C256M16D3LB-12BINTR is a DDR3 SDRAM module with a 240-pin DIMM form factor.Question: Can the AS4C256M16D3LB-12BINTR be used in laptops or mobile devices?
Answer: No, the AS4C256M16D3LB-12BINTR is not suitable for laptops or mobile devices as it uses a DIMM form factor.Question: What is the operating temperature range of the AS4C256M16D3LB-12BINTR?
Answer: The AS4C256M16D3LB-12BINTR has an operating temperature range of -40°C to +85°C.Question: Can the AS4C256M16D3LB-12BINTR be used in high-performance computing applications?
Answer: Yes, the AS4C256M16D3LB-12BINTR can be used in high-performance computing applications that require reliable and fast memory.Question: Is the AS4C256M16D3LB-12BINTR compatible with DDR2 or DDR4 memory slots?
Answer: No, the AS4C256M16D3LB-12BINTR is only compatible with DDR3 memory slots.