AS4C256M8D3LB-12BINTR

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-density storage
  • Low power consumption
  • Fast data transfer rate
• Package: BGA (Ball Grid Array)
• Essence: Non-volatile memory chip
• Packaging/Quantity: Individually packaged, quantity varies based on manufacturer

Specifications

• Model: AS4C256M8D3LB-12BINTR
• Organization: 256 Megabit (32 Megabyte) x 8
• Speed: 12ns
• Voltage: 3.3V
• Interface: Synchronous DRAM (SDRAM)
• Operating Temperature: -40°C to +85°C
• RoHS Compliance: Yes

Detailed Pin Configuration

The AS4C256M8D3LB-12BINTR has a total of 66 pins. The pin configuration is as follows:

1. VDD
2. DQ0
3. DQ1
4. DQ2
5. DQ3
6. DQ4
7. DQ5
8. DQ6
9. DQ7
10. VSS
11. DQ8
12. DQ9
13. DQ10
14. DQ11
15. DQ12
16. DQ13
17. DQ14
18. DQ15
19. VSS
20. A0
21. A1
22. A2
23. A3
24. A4
25. A5
26. A6
27. A7
28. A8
29. A9
30. A10
31. A11
32. A12
33. A13
34. A14
35. A15
36. VSS
37. /CAS
38. /RAS
39. /WE
40. /CS0
41. /CS1
42. /CS2
43. /CS3
44. VDD
45. VDDQ
46. VSSQ
47. DQS0
48. DQS1
49. DM0
50. DM1
51. VSS
52. CLK
53. CKE
54. /CKE
55. /RESET
56. VREF
57. VSS
58. VCCPLL
59. VSSPLL
60. PLLIN
61. PLLOUT
62. VSS
63. VDD
64. VDDQ
65. VSSQ
66. NC

Functional Features

• High-speed data transfer with synchronous operation
• Burst mode for efficient memory access
• Auto-refresh and self-refresh modes for power saving
• On-die termination (ODT) for improved signal integrity
• Internal pipelined architecture for continuous data flow

Advantages and Disadvantages

Advantages: - High-density storage capacity - Fast data transfer rate - Low power consumption - Improved signal integrity with on-die termination - Suitable for various applications requiring high-performance memory

Disadvantages: - Relatively higher cost compared to other memory options - Limited compatibility with older systems due to specific interface requirements

Working Principles

The AS4C256M8D3LB-12BINTR is a synchronous dynamic random-access memory (SDRAM) module. It stores digital information in a non-volatile manner, allowing for quick retrieval and modification of data. The memory operates synchronously with the system clock, enabling high-speed data transfer. The on-die termination feature helps maintain signal integrity by reducing reflections and noise. The memory module supports burst mode, auto-refresh, and self-refresh functions to optimize performance and power consumption.

Detailed Application Field Plans

The AS4C256M8D3LB-12BINTR is widely used in various electronic devices and systems that require high-density and high-performance memory. Some common application fields include: - Personal computers - Laptops and notebooks - Servers and data centers - Networking equipment - Embedded systems - Consumer electronics (e.g., gaming consoles, set-top boxes)

Detailed and Complete Alternative Models

• AS4C256M8D3LB-12BCNTR
• AS4C256M8D3LB-12BCINTR
• AS4C256M8D3LB-12BCN
• AS4C256M8D3LB-12BIN

These alternative models offer similar specifications and functionality to the AS4C256M8D3LB-12BINTR, providing options for different sourcing and compatibility requirements.

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