AS4C512M16D3L-12BCNTR

Product Overview

Category

AS4C512M16D3L-12BCNTR belongs to the category of computer memory modules.

Use

It is used as a Random Access Memory (RAM) module in various electronic devices, such as computers, servers, and embedded systems.

Characteristics

• Capacity: 512 Megabytes (MB)
• Organization: 16M words x 16 bits
• Speed: 1200 MHz (DDR3-1200)
• Voltage: 1.5V
• Package Type: BGA (Ball Grid Array)
• Operating Temperature: -40°C to +85°C

Packaging/Quantity

AS4C512M16D3L-12BCNTR is typically packaged in trays or reels. The quantity per package depends on the manufacturer's specifications.

Specifications

• Memory Type: DDR3 SDRAM
• Memory Configuration: 512 Megabytes (MB), organized as 16M words x 16 bits
• Data Rate: 1200 MHz
• CAS Latency: 12
• Voltage: 1.5V
• Package Type: BGA
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C512M16D3L-12BCNTR module has a specific pin configuration for proper installation and operation. Please refer to the datasheet provided by the manufacturer for the detailed pinout diagram.

Functional Features

• High-speed data transfer rate of 1200 MHz ensures efficient performance.
• Low operating voltage of 1.5V reduces power consumption.
• BGA package provides better thermal dissipation and mechanical stability.
• Wide operating temperature range allows usage in various environments.

Advantages

• Fast data transfer rate enhances system responsiveness.
• Low power consumption helps in energy-efficient designs.
• BGA package ensures reliable connections and improved durability.
• Wide operating temperature range enables usage in extreme conditions.

Disadvantages

• Limited capacity of 512 Megabytes may not be sufficient for memory-intensive applications.
• DDR3 technology is older compared to newer generations like DDR4 or DDR5.

Working Principles

AS4C512M16D3L-12BCNTR operates based on the Double Data Rate (DDR) technology. It stores data in a matrix of capacitors, which can be accessed and manipulated at high speeds. The module communicates with the system's memory controller to read and write data as required by the processor.

Detailed Application Field Plans

AS4C512M16D3L-12BCNTR finds application in various fields, including: 1. Personal computers and laptops 2. Servers and data centers 3. Networking equipment 4. Industrial automation systems 5. Medical devices 6. Automotive electronics

Detailed and Complete Alternative Models

Some alternative models that can be considered as alternatives to AS4C512M16D3L-12BCNTR are: 1. AS4C256M16D3L-12BCNTR: 256 Megabytes capacity, same characteristics and specifications. 2. AS4C1024M16D3L-12BCNTR: 1 Gigabyte capacity, same characteristics and specifications. 3. AS4C512M32D3L-12BCNTR: 512 Megabytes capacity, organized as 32M words x 16 bits, same characteristics and specifications.

Note: Please refer to the manufacturer's documentation for the most up-to-date information on alternative models.

In conclusion, AS4C512M16D3L-12BCNTR is a computer memory module used in various electronic devices. It offers high-speed data transfer, low power consumption, and wide operating temperature range. While it has some limitations in terms of capacity and technology, it serves as a reliable memory solution for different applications.