EP1S60F1508C6

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Programmable Logic Device (PLD)
• Characteristics: High-performance, low-power consumption
• Package: 1508-ball FineLine BGA package
• Essence: Field-Programmable Gate Array (FPGA)
• Packaging/Quantity: Single unit

Specifications

• Technology: 90nm Flash-based
• Logic Elements: 60,000
• Embedded Memory: 1.5 Mbit
• I/O Pins: 208
• Operating Voltage: 1.2V
• Speed Grade: 6

Detailed Pin Configuration

The EP1S60F1508C6 has a total of 208 pins, each serving a specific purpose in the circuit. The pin configuration is as follows:

• Pin 1: VCCIO
• Pin 2: GND
• Pin 3: IOL1PCCLK_0
• Pin 4: IOL1NCCLK_0
• ...
• Pin 207: IOL208PGCLK_0
• Pin 208: IOL208NGCLK_0

Functional Features

• High-performance FPGA with advanced programmability
• Low-power consumption for energy-efficient applications
• Flash-based technology allows for reconfiguration and updates
• Versatile I/O capabilities for interfacing with external devices
• Supports various communication protocols and standards

Advantages and Disadvantages

Advantages: - Flexibility in design due to programmability - Faster time-to-market compared to custom ASICs - Lower development costs compared to ASICs - Ability to reconfigure and update the device

Disadvantages: - Higher power consumption compared to dedicated hardware - Limited performance compared to specialized ASICs - Higher cost per unit compared to mass-produced ASICs

Working Principles

The EP1S60F1508C6 is based on FPGA technology, which utilizes a matrix of configurable logic blocks and programmable interconnects. The device can be programmed to implement various digital circuits and functions by configuring the logic elements and interconnections using a hardware description language (HDL). During operation, the FPGA executes the programmed logic, enabling the desired functionality.

Detailed Application Field Plans

The EP1S60F1508C6 finds applications in various fields, including: 1. Telecommunications: Used in network equipment for data processing and protocol handling. 2. Industrial Automation: Employed in control systems for process monitoring and automation. 3. Consumer Electronics: Integrated into multimedia devices for signal processing and interface control. 4. Automotive: Utilized in automotive electronics for engine management and driver assistance systems. 5. Aerospace: Incorporated in avionics systems for navigation, communication, and control.

Detailed and Complete Alternative Models

1. EP1S40F780C6: Smaller version with 40,000 logic elements and 780-ball package.
2. EP1S80F1020C6: Larger version with 80,000 logic elements and 1020-ball package.
3. EP1S120F1508C6: Higher-density version with 120,000 logic elements and 1508-ball package.
4. EP1S200F1517C6: Enhanced version with 200,000 logic elements and 1517-ball package.
5. EP1S320F1692C6: High-capacity version with 320,000 logic elements and 1692-ball package.

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