59065-3-V-02-D Product Overview
Product Identification - Product Name: 59065-3-V-02-D - Category: Electronic Component - Use: Electrical connection and signal transmission - Characteristics: Compact design, high conductivity, durable construction - Package: Sealed plastic packaging - Essence: Facilitates secure and reliable electrical connections - Packaging/Quantity: Sold in packs of 100 units
Specifications - Material: Copper alloy - Voltage Rating: 300V - Current Rating: 10A - Operating Temperature: -40°C to 105°C - Insulation Resistance: 1000MΩ min - Contact Resistance: 10mΩ max
Detailed Pin Configuration - The 59065-3-V-02-D features a 3-pin configuration with precise alignment for easy insertion and removal.
Functional Features - Secure and reliable electrical connections - High conductivity for efficient signal transmission - Durable construction for long-term use
Advantages and Disadvantages - Advantages: - Compact design saves space - High conductivity ensures efficient performance - Durable construction for long-term reliability - Disadvantages: - Limited voltage and current ratings compared to some alternatives
Working Principles - The 59065-3-V-02-D facilitates electrical connections by securely joining conductors, ensuring efficient signal transmission.
Detailed Application Field Plans - Automotive Industry: Used in vehicle wiring harnesses for reliable electrical connections. - Consumer Electronics: Incorporated into electronic devices for signal transmission. - Industrial Equipment: Utilized in machinery and control systems for electrical connectivity.
Detailed and Complete Alternative Models - Model A: Higher voltage and current ratings for industrial applications - Model B: Enhanced insulation resistance for critical electronic systems - Model C: Compact design with increased pin count for space-constrained installations
This comprehensive entry provides an in-depth understanding of the 59065-3-V-02-D product, including its specifications, functional features, advantages, disadvantages, working principles, application field plans, and alternative models.