MT29FEN64GDKCAAXDQ-10:A

Basic Information Overview

• Category: Memory Device
• Use: Data storage and retrieval
• Characteristics:
  • Non-volatile
  • High capacity
  • Fast read/write speeds
• Package: BGA (Ball Grid Array)
• Essence: Flash memory chip
• Packaging/Quantity: Single chip

Specifications

• Model: MT29FEN64GDKCAAXDQ-10:A
• Capacity: 64GB
• Interface: NAND
• Voltage: 3.3V
• Speed: 10ns
• Operating Temperature: -40°C to +85°C

Detailed Pin Configuration

The MT29FEN64GDKCAAXDQ-10:A flash memory chip has the following pin configuration:

1. VCC
2. GND
3. A0
4. A1
5. A2
6. A3
7. A4
8. A5
9. A6
10. A7
11. A8
12. A9
13. A10
14. A11
15. A12
16. A13
17. A14
18. A15
19. A16
20. A17
21. A18
22. A19
23. A20
24. A21
25. A22
26. A23
27. A24
28. A25
29. A26
30. A27
31. A28
32. A29
33. A30
34. A31
35. CLE
36. ALE
37. RE#
38. WE#
39. WP#
40. R/B#
41. CE#
42. DQ0
43. DQ1
44. DQ2
45. DQ3
46. DQ4
47. DQ5
48. DQ6
49. DQ7

Functional Features

• High-speed data transfer
• Reliable data storage
• Low power consumption
• Error correction capabilities
• Wear-leveling algorithms for extended lifespan

Advantages and Disadvantages

Advantages: - Large storage capacity - Fast read/write speeds - Non-volatile memory - Low power consumption

Disadvantages: - Limited write endurance - Higher cost compared to other memory technologies

Working Principles

The MT29FEN64GDKCAAXDQ-10:A flash memory chip utilizes NAND technology to store and retrieve data. It consists of a grid of memory cells, where each cell can store multiple bits of information. The data is stored by trapping electric charges in the floating gate of each memory cell. To read or write data, specific voltage levels are applied to the appropriate pins, allowing the charge to be sensed or modified.

Detailed Application Field Plans

The MT29FEN64GDKCAAXDQ-10:A flash memory chip finds applications in various fields, including: 1. Consumer electronics (e.g., smartphones, tablets, digital cameras) 2. Automotive systems (e.g., infotainment, navigation) 3. Industrial equipment (e.g., control systems, data loggers) 4. Networking devices (e.g., routers, switches) 5. Medical devices (e.g., patient monitoring, imaging systems)

Detailed and Complete Alternative Models

1. MT29FEN128GDKCAAXDQ-10:A - 128GB capacity, same specifications as MT29FEN64GDKCAAXDQ-10:A
2. MT29FEN32GDKCAAXDQ-10:A - 32GB capacity, same specifications as MT29FEN64GDKCAAXDQ-10:A
3. MT29FEN256GDKCAAXDQ-10:A - 256GB capacity, same specifications as MT29FEN64GDKCAAXDQ-10:A

(Note: The above alternative models are for illustrative purposes and may not reflect actual product availability.)

This entry provides an overview of the MT29FEN64GDKCAAXDQ-10:A flash memory chip, including its basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.