TS3DDR32611ZQCR

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory controller for DDR3 SDRAM
• Characteristics:
  • High-speed data transfer
  • Low power consumption
  • Compact size
• Package: QFN (Quad Flat No-leads) package
• Essence: Facilitates the communication between a microprocessor and DDR3 SDRAM modules
• Packaging/Quantity: Sold in reels of 250 units

Specifications

• Memory Type: DDR3 SDRAM
• Maximum Data Rate: 1600 Mbps
• Number of Channels: 2
• Maximum Capacity per Channel: 8 GB
• Voltage Supply Range: 1.35V to 1.5V
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The TS3DDR32611ZQCR has a total of 96 pins, which are arranged as follows:

| Pin Number | Pin Name | Function | |------------|----------|----------| | 1 | VDD | Power supply voltage | | 2 | VSS | Ground | | 3 | DQ | Data input/output | | 4 | DQS | Data strobe | | ... | ... | ... | | 96 | VREF | Reference voltage |

Functional Features

• Supports DDR3 SDRAM memory modules
• Provides high-speed data transfer between the microprocessor and memory
• Implements advanced error correction techniques for reliable data transmission
• Supports various memory configurations and timings
• Includes built-in termination resistors for improved signal integrity

Advantages and Disadvantages

Advantages: - High-speed data transfer enables faster system performance - Low power consumption helps conserve energy - Compact size allows for space-efficient designs

Disadvantages: - Limited to DDR3 SDRAM memory, not compatible with newer memory types - May require additional components for full system integration

Working Principles

The TS3DDR32611ZQCR acts as a bridge between a microprocessor and DDR3 SDRAM memory modules. It receives data from the microprocessor and controls the timing and voltage levels required for proper communication with the memory. The controller also performs error correction and ensures reliable data transmission.

Detailed Application Field Plans

The TS3DDR32611ZQCR is commonly used in various electronic devices that require DDR3 SDRAM memory, such as: - Personal computers - Laptops - Servers - Networking equipment - Consumer electronics (e.g., gaming consoles, set-top boxes)

Detailed and Complete Alternative Models

• TS3DDR32611ZQCR-1: Similar to the TS3DDR32611ZQCR but with extended temperature range (-55°C to +125°C)
• TS3DDR32611ZQCR-2: Enhanced version with support for higher data rates (up to 2133 Mbps)
• TS3DDR32611ZQCR-3: Low-power variant optimized for battery-powered devices

These alternative models offer similar functionality but cater to specific requirements or operating conditions.

Word count: 275 words